Please use this identifier to cite or link to this item: http://hdl.handle.net/20.500.12666/832
Title: RF measurements for future communication applications: an overview
Authors: Allal, D.
Bannister, R.
Buisman, K.
Capriglione, D.
Di Capua, G.
García Patrón Mendiburu, Martín
Gatzweiler, T.
Gellersen, F.
Harzheim, T.
Heuermann, H.
Hoffmann, J.
Izbrodin, A.
Kuhlmann, K.
Lahbacha, K.
Maffucci, A.
Miele, G.
Mubarak, F.
Salter, M.
Pham, T. D.
Sayegh, A.
Singh, D.
Stein, F.
Zeier, M.
Keywords: FPGA;Signal integrity;Power integrity;Passive inter-modulation;Metrological characterization
Issue Date: 20-Jul-2022
Publisher: Institute of Electrical and Electronics Engineers
Published version: https://ieeexplore.ieee.org/document/9887740
Citation: Proceedings of the IEEE International Symposium on Measurements and Networking 2022
Abstract: In this paper research activities developed within the FutureCom project are presented. The project, funded by the European Metrology Programme for Innovation and Research (EMPIR), aims at evaluating and characterizing: (i) active devices, (ii) signal- and power integrity of field programmable gate array (FPGA) circuits, (iii) operational performance of electronic circuits in real-world and harsh environments (e.g. below and above ambient temperatures and at different levels of humidity), (iv) passive inter-modulation (PIM) in communication systems considering different values of temperature and humidity corresponding to the typical operating conditions that we can experience in real-world scenarios. An overview of the FutureCom project is provided here, then the research activities are described.
URI: http://hdl.handle.net/20.500.12666/832
ISBN: 9781665483629
E-ISSN: 2639-5061
ISSN: 2639-507X
Appears in Collections:(Espacio) Comunicaciones de Congresos

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